finite volume methods; reflow soldering; solders; FVM model; Newtonian properties; attack angle; finite volume method; geometrical model; nonNewtonian liquids; nonNewtonian solder paste properties; pressure distribution; reflow soldering technology; stencil printing process; stencil surface; Accuracy; Analytical models; Numerical models; Printing; Semiconductor device modeling; Surface treatment; Viscosity; Finite Volume Method; non-Newtonian properties; reflow soldering; solder paste; stencil printing;
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