Integrated Circuit Repackaging to Plastic Package for Fault Isolation

摘要

Failure analysis is very important in semiconductor business not only for customer satisfaction but also for process improvement and new product development. A successful failure analysis depends mainly on accurate failure verification, appropriate fault isolation techniques, and precise physical analysis steps implemented on the specimen. However, the trend in package development of current ICs makes it a challenge if not possible to perform fault isolation using the current equipment for Failure Analysis (FA). Thus, the sample or specimen must be prepared in a way that the fault isolation steps can be performed. In this paper, an innovative repackaging process using a plastic package is presented. This repackaging process enables the specimen to be tested and get accurate failure verification. This also allows the sample to be subjected to appropriate fault isolation steps without hindrances and to be compatible to physical analysis steps and keep the cost of sample preparation at the minimum.