Yagi antenna arrays; baluns; millimetre wave antenna arrays; three-dimensional integrated circuits; RDL technology; TSI platform; antenna exciter; differential Yagi-Uda antenna; frequency 60 GHz; half-wavelength dipole; impedance matching; metal layers; open-circuited stub functions; rear feeding network; redistributed layer technology; through silicon interposer platform; wideband Marchand balun; Antenna feeds; Broadband antennas; Dipole antennas; Impedance matching; Silicon; Wideband; Yagi-Uda antennas;
机译:在硅中介层上使用耦合磁芯电感的2.5D集成稳压器
机译:一种新型的中介层的制造和电学特性,该中介层具有用于2.5D / 3D应用的具有超低电阻率的直通硅通孔(TSV)的聚合物衬里和硅柱
机译:2.5D IC中的硅中介层基于边界扫描的互连测试设计
机译:60GHz宽带Yagi-UDA天线通过硅插入器集成在2.5D上
机译:适用于高速应用的60GHz集成硅片上集成天线
机译:基于带有固态等离子体的硅反射器的可重构八木宇田天线
机译:23.1采用硅中介层上的耦合磁芯电感器的2.5D集成稳压器,提供10.8a / mm 2