Fabrication of VGA size near-infrared image sensor using room-temperature flip-chip bonding technology

摘要

Room-temperature bonding technique using cone-shaped microbumps with the aid of ultrasonic vibration is applied to the fabrication of a near-infrared image sensor. The image sensor is fabricated using the flip-chip bonding of an InGaAs/InP photodiode-array chip and a Si CMOS readout IC chip. The pixel pitch is 15 μm to compose VGA class (640 × 512 pixels) resolution. High-quality imaging of a heated object and blood vessels of human hand is demonstrated.