MOSFET circuits; SPICE; capacitive sensors; high-pressure techniques; high-temperature electronics; microsensors; pressure sensors; signal conditioning circuits; silicon compounds; wide band gap semiconductors; MOSFET; SPICE models; SiC; capacitive pressure sensor; capacitive sensor; circuit design; commercial electronic design automation; harsh environment applications; high pressure conditions; high temperature conditions; sensor interface circuit; touch mode operation; Analytical models; Integrated circuit modeling; Mathematical model; Numerical models; SPICE; Silicon carbide; Temperature measurement; FEA simulation; capacitive sensor; model extraction; silicon carbide;
机译:用于苛刻环境应用的多晶硅 - 绝缘体(PolysoI)和基于SOI的微压阻压力传感器的制造与表征
机译:基于硅玻璃的单压阻式压力传感器,适用于恶劣环境应用
机译:电场涉及纳米晶碳化硅氮化物(NC-SiCN)薄膜升高温度的运输,用于苛刻的环境应用
机译:基于碳化硅的基于碳化物的压力传感解决方案的建模与仿真
机译:基于微放电的压力控制设备及其在恶劣环境下的化学传感应用。
机译:利用高温电子的恶劣环境无线压力传感解决方案
机译:基于碳化硅电子器件的压力传感器接口电路,用于苛刻环境运行
机译:适用于恶劣环境应用的碳化硅传感器和电子设备