首页> 外文会议>ASME international manufacturing science and engineering conference >WEDGE RADIUS EFFECTS IN MECHANICAL EXFOLIATION OF HOPG: A MOLECULAR SIMULATION STUDY
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WEDGE RADIUS EFFECTS IN MECHANICAL EXFOLIATION OF HOPG: A MOLECULAR SIMULATION STUDY

机译:HOPG机械剥离中的楔形半径效应:分子模拟研究

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We study the effects of wedge bluntness in mechanically exfoliating graphene layers from highly ordered pyrolytic graphite (HOPG), a layered material. Molecular dynamics simulations show that the layer initiation modes strongly depend on the wedge radius. Force and specific energy signatures are also markedly affected by the radius. Cleaving with a larger wedge radius causes buckling ahead of the wedge; larger the radius more the buckling. A critical depth of insertion of 1.6 A° is seen necessary to cleave a single layer; this is also found to be independent of wedge radius. Hence, with accurate positioning on an atomically flat HOPG surface it is possible to mechanically cleave, using a wedge, a single sheet of graphene even with a blunt wedge.
机译:我们研究了从高度有序的热解石墨(HOPG)(一种层状材料)机械剥落石墨烯层中楔形钝化的影响。分子动力学模拟表明,层起始模式很大程度上取决于楔形半径。半径也显着影响力和特定的能量特征。劈开较大的楔形半径会导致在楔形之前弯曲。半径越大,屈曲越大。切割单层时,必须达到1.6 A°的临界插入深度。还发现这与楔形半径无关。因此,通过在原子平坦的HOPG表面上进行精确定位,可以使用楔子机械切割单张石墨烯,即使钝的楔子也是如此。

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