首页> 外文会议>ASME international manufacturing science and engineering conference >WEDGE RADIUS EFFECTS IN MECHANICAL EXFOLIATION OF HOPG: A MOLECULAR SIMULATION STUDY
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WEDGE RADIUS EFFECTS IN MECHANICAL EXFOLIATION OF HOPG: A MOLECULAR SIMULATION STUDY

机译:HOPG机械剥离中的楔形半径效应:分子模拟研究

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We study the effects of wedge bluntness in mechanically exfoliating graphene layers from highly ordered pyrolytic graphite (HOPG), a layered material. Molecular dynamics simulations show that the layer initiation modes strongly depend on the wedge radius. Force and specific energy signatures are also markedly affected by the radius. Cleaving with a larger wedge radius causes buckling ahead of the wedge; larger the radius more the buckling. A critical depth of insertion of 1.6 A° is seen necessary to cleave a single layer; this is also found to be independent of wedge radius. Hence, with accurate positioning on an atomically flat HOPG surface it is possible to mechanically cleave, using a wedge, a single sheet of graphene even with a blunt wedge.
机译:我们研究了楔形钝性在机械剥离石墨烯层中的效果从高度有序的热解石墨(HOPG),层状材料。分子动力学模拟表明,层起始模式强烈取决于楔形半径。力和特定能量签名也显着受到半径的影响。用较大的楔形半径切割导致楔子前面的弯曲;屈曲的半径越大。需要临界插入1.6 A°的临界深度以切割单层;这也被发现与楔半径无关。因此,在原子平坦的跳跃表面上精确定位,即使用钝楔,也可以使用楔形物地机械地切割一张石墨烯。

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