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Influence of Flexibility of Polishing Tool on The Microscopic Figure of Spinel Surface and Optimal Design

机译:抛光工具灵活性对尖晶石表面微观图的影响及最优设计

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Spinel has outstanding optical performances and mechanical performances, and it is suitable material for infrared window and dome. But it is extremely difficult to machine spinel with high accuracy, especially in the machining process with compliant polishing tools, grain profiles will appear on the machined surface, which will result in the deterioration for machining accuracy, surface quality and optical performance. In this paper, analyzing the microscopic figure of spinel in the process of complaint polishing and founding the gradient change obviously on the edge of the grain profile, which has significant influence on the surface roughness. The spinel substrates are separately polished by using pitch tool, polyurethane tool and magnetorheological fluid, the values of surface roughness are respectively Ra 2.3nm, Ra 8.5nm and Ra 64.6nm, and the corresponding characteristic scales of grain profile are 180μm~200μm, 160μm~200μm and 200μm~250μm. Furthermore, the peak value of grain profile is proportional to the polishing tool flexibility, inverse proportional to the rigidity and the size of polishing powder, and the flexibility expression for polishing tool is given on the conditions of different machining parameters. On this basis, the high accuracy and ultra smooth surface of the spinel are obtained by the optimum polishing conditions.
机译:尖晶石具有出色的光学性能和机械性能,它是红外窗口和圆顶的合适材料。但是,通过高精度加工尖晶石是非常困难的,特别是在具有柔顺抛光工具的加工过程中,机加工表面上会出现晶粒型材,这将导致加工精度,表面质量和光学性能的劣化。在本文中,在谷物曲线边缘的边缘分析投诉抛光过程中尖晶石的微观图,这对表面粗糙度产生了重大影响。通过使用俯仰工具,聚氨酯工具和磁流变流体分别抛光尖晶石基板,表面粗糙度的值分别为Ra 2.3nm,Ra 8.5nm和Ra 64.6nm,并且相应的晶粒曲线的特性尺度为180μm〜200μm,160μm 〜200μm和200μm〜250μm。此外,晶粒谱的峰值与抛光工具柔性成比例,与抛光粉末的刚性和尺寸成比例,并且对不同加工参数的条件给出了抛光工具的柔韧性表达。在此基础上,通过最佳的抛光条件获得尖晶石的高精度和超光滑表面。

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