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Emerging Electronic Devices for THz Sensing and Imaging

机译:新兴的太赫兹感测和成像电子设备

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Continuing advances in scaling of conventional semiconductor devices are enabling mainstream electronics to operate in the millimeter-wave through THz regime. At the same time, however, novel devices and device concepts are also emerging to address the key challenges for systems in this frequency range, and may offer performance and functional advantages for future systems. In addition to new devices, advances in integration technology and novel system concepts also promise to provide substantial system-level performance and functionality enhancements. Several emerging devices and device concepts, as well as circuit-level concepts to take advantage of them, are discussed. Based on unconventional semiconductor device structures and operational principles, these devices offer the potential for significantly improved system sensitivity and frequency coverage. When combined in arrays, features such as polarimetric detection and frequency tunability for imaging can be achieved. As examples of emerging devices for millimeter-wave through THz sensing and imaging, heterostructure backward diodes in the InAs/AlSb/GaSb material system and GaN-based plasma-wave high electron mobility transistors (HEMTs) will be discussed. Based on interband tunneling, heterostructure backward diodes offer significantly increased sensitivity and extremely low noise for direct detection applications, and have been demonstrated with cutoff frequencies exceeding 8 THz. The plasma-wave HEMT is an emerging device concept that, by leveraging plasma-wave resonances in the two-dimensional electron gas within the channel of the HEMT, offers the prospect for both tunable narrowband detection as well as low-noise amplification at frequencies well into the THz. These emerging devices are both amenable to direct integration within compact planar radiating structures such as annular slot antennas for realization of polarimetric detection and frequency tuning for spectroscopy and imaging.
机译:常规半导体器件尺寸的不断进步使主流电子器件能够通过THz体制在毫米波中运行。但是,与此同时,新颖的设备和设备概念也应运而生,以解决该频率范围内系统的关键挑战,并可能为未来的系统提供性能和功能优势。除了新设备之外,集成技术的进步和新颖的系统概念也有望提供实质性的系统级性能和功能增强。讨论了几种新兴的设备和设备概念,以及利用它们的电路级概念。基于非常规的半导体器件结构和操作原理,这些器件具有显着提高系统灵敏度和频率覆盖范围的潜力。当以阵列形式组合时,可以实现诸如偏振检测和成像频率可调性之类的功能。作为用于THz感应和成像的毫米波新兴设备的示例,将讨论InAs / AlSb / GaSb材料系统中的异质结构反向二极管和GaN基等离子波高电子迁移率晶体管(HEMT)。基于带间隧穿,异质结构反向二极管为直接检测应用提供了显着提高的灵敏度和极低的噪声,并且已经证明其截止频率超过8 THz。等离子体波HEMT是新兴的设备概念,它通过利用HEMT通道内二维电子气中的等离子体波共振,为可调谐窄带检测以及在频率良好的情况下进行低噪声放大提供了前景进入太赫兹这些新兴设备都可以直接集成在紧凑的平面辐射结构中,例如环形缝隙天线中,以实现极化检测和光谱和成像的频率调谐。

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