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Design of Thermal-Aware and Power-Efficient LFSR on Different Nanometer Technology FPGA for Green Communication

机译:不同纳米技术FPGA热感知和高效LFSR设计绿色通信

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With the advancement in technologies, industrialization, and rapid growth of population, the globe is much affected by the mess of power and energy crisis. Therefore, there is a need for the technologies of the green communication system and energy/power-efficient devices so that the future needs of energy and power can be fulfilled. This work, highlights the implementation of a power-efficient Linear Feedback Shift Register (LFSR) on various Field Programmable Gate Array (FPGA) devices. For the implementation of LFSR, Xilinx Design Suite is used and the power of LFSR with different FPGAs is analyzed with the X Power Analyzer tool. It is observed that there is a reduction of 98.91% total power for Spartan-6 in comparison to Virtex-6 FPGA. Apart from total power, thermal properties of FPGA devices such as junction temperature, effective thermal resistance to air, and maximum ambient temperature are also analyzed here. It is observed that as the gate size of the FPGA device gets decreased the operating temperature that is the junction temperature also gets decreased. Therefore there is a 52.33% decrement in operating temperature for Spartan-6 in comparison to Virtex-6 FPGA. As a future scope, this LFSR circuit can also be designed on 7th series and ultra-scale FPGA devices to make the circuit more power- efficient to promote green communication
机译:随着技术,产业化和人口的快速增长的推进,全球对电力和能源危机的混乱影响了很大。因此,需要一种绿色通信系统和能量/功率高效设备的技术,以便可以实现未来的能量和功率的需求。这项工作突出显示各种现场可编程门阵列(FPGA)设备上的高效线性反馈移位寄存器(LFSR)的实现。对于LFSR的实现,使用Xilinx设计套件,并使用X Power Analyzer工具分析了具有不同FPGA的LFSR的功率。据观察,与Virtex-6 FPGA相比,Spartan-6总功率降低了98.91%。除了总功率外,还在这里分析了与结温,有效的热阻和最大环境温度的FPGA器件的热性能。观察到,由于FPGA器件的栅极尺寸降低了结温的操作温度也降低。因此,与Virtex-6 FPGA相比,Spartan-6的工作温度下降了52.33%。作为未来的范围,此LFSR电路也可在7上设计 th 系列和超级FPGA器件使电路更加有效地促进绿色通信

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