Development of Liquid, Granule and Sheet Type Epoxy Molding Compounds for Fan Out Wafer Level Package

摘要

In worldwide semiconductor market has still inflated and required advanced, smaller, and lower cost package. From recently this situation, Fan-Out Wafer Level Package (FOWLP)/Panel Level Package has commercialized to fit for above demands. In this report, our three types of encapsulation materials, i.e., Liquid, Granule/Powder and Sheet encapsulation material, were expressed to apply for FOWLP/Panel Level Package. Those materials have each suitable manufacturing process. For example, one of them is Face up type Compression mold, other one is Face down type Compression mold and Vacuum lamination method and so on. We researched the best condition with each material and manufacturing process. In the future viewpoint, encapsulation for FOWLP/Panel Level Package, the warpage issue must be an especially key point for future application and more scale up process. The warpage issue for each encapsulation material and manufacturing process is discussed in here. We have experimented and verified the tendency of warpage with changing properties, constituent, and processes of each encapsulation. Firstly, in the Liquid area, we have checked as to how much influence different hardeners and encapsulation processes have on warpage. Secondly, in the Mold Sheet area, we verified the impact of process difference to warpage. Lastly, in the Granule/Powder area we verified the relation between several types of hardeners and curing degrees and warpage. In the experiment of influence of hardener on warpage, we have touched not only changing types of hardeners but also effect of catalyst. Also in the verification of curing degrees, we prepared some samples that had different curing degrees, for example, 50%, 70%, 90% before PMC (Post Mold Cure). And we checked the warpage of each sample after PMC. As for encapsulation processes, vacuum lamination and two types of compression mold equipment were used. As above, we tried to reduce the warpage with the combination of various conditions.