Damage Prediction for Electronic Package Drop Test using Finite Element Method and Peridynamic Theory

摘要

Finite element method and peridynamic theory are coupled via submodeling approach to investigate the dynamic response and damage in an electronic package subjected to impact loading arising from drop-shock. The global modeling is performed using the finite element method while the peridynamic theory is employed for the submodeling and failure prediction. The analysis yielded the outermost solder joint as the critical joint with failure at the interface between the solder and copper pad on the PCB side.