Ag wire and Ag alloy wire reliability and molding compounds

摘要

Ag wire and Ag alloy wire reliability experiments were conducted on both 28-lead SOP and 96-pin PBGApackages. Biased HAST (b-HAST) of Ag-wired packages with higher ion content molding compoudsgenerated obvious defects promoted by ion accumulation mechanism. Intermetallic compounds (IMCs) at thecorroded interface are identified using cross-sectional TEM/EDX. Ion selective affinity of intermetalliccompound is rationalized using ab initio molecular dynamics simulation.