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PULL-IN BEHAVIOR AND MULTISTABILITY OF A CURVED MICROBEAM ACTUATED BY A DISTRIBUTED ELECTROSTATIC FORCE

机译:分布式静电力致动的弯曲微沟的拉入行为和多个

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In this work we report on theoretical and experimental investigation of a multistability phenomenon in initially curved flexible clamped-clamped microbeams actuated in-plane by a distributed electrostatic force and fabricated from silicon on insulator (SOI) wafer using a deep reactive ion etching (DRIE) process. Theoretical results provided by a reduced order (RO) model of the shallow Euler-Bernoulli arch and backed by experiments indicate that in the device with non-monotonous stiffness-deflection dependence the voltage-deflection characteristic may have two maxima implying the existence of multiple stable configurations at the same voltage while the range of stable deflections is significantly larger and pull-in voltage is lower than in a straight beam.
机译:在这项工作中,我们通过分布式静电力在平面内致动的初始弯曲的柔性夹紧夹紧的微沟,并使用深反应离子蚀刻从绝缘体(SOI)晶片上由硅制成(DRIE)的理论和实验研究的理论和实验研究。过程。由浅欧拉伯尔诺拱的减少(RO)模型提供的理论结果,并通过实验支持表示,在具有非单调刚度偏转依赖性的装置中,电压偏转特性可能具有两个最大值,这暗示存在多个稳定的存在性在相同的电压下配置,而稳定偏转范围明显较大,并且拉出电压低于直梁。

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