Signal Integrity Considerations of PCB Wiring in Tightly Pitched Module Pin Fields of High Speed Channels

摘要

Effects of PCB wiring in tightly pitched module pin fields on high speed channel signal integrity are evaluated in this paper. Three different module orthogonal pin pitches are considered: 0.8mm, 1.06mm and 1.27mm. Each of the pin pitch scenarios is represented through corresponding PCB via and PCB pin area wiring models. Frequency domain SI metrics, at 16GHz, of a full end to end channel including the different tightly pitched module PCB wiring scenarios are quantified, compared and discussed. Additionally, full channel time domain eye simulations carried out at 32Gb/s are used to evaluate effects on eye opening and correlate with the frequency domain observations.