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Low Temperature High-k Solution Processed Hybrid Gate Insulator for High Performance Amorphous In-Ga-Zn-O Thin-Film Transistors

机译:低温高钾溶液加工用于高性能无定形IN-ZN-O薄膜晶体管的混合栅极绝缘体

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Low temperature process is required to fabricate high performance amorphous In-Ga-Zn-O (a-IGZO) thin-film transistors (TFTs) on plastic substrates for flexible display applications. In addition, high-k material which allows higher mobility, higher drain current and lower threshold voltage while facilitating miniaturization, is poised to replace conventional SiO2 gate insulators in TFTs. Therefore, hybrid material containing high-k BaTiO3 nanoparticles and transparent Poly-siloxane (Poly-SX) were used as gate insulator in a-IGZO TFTs. Opting for a hybrid material instead of only a BaTiO3 film enables lowering of process temperatures. This paper presents the performance of a-IGZO TFTs with solution processed hybrid gate insulators at different BaTiO3/Poly-SX ratios deposited at a lower temperature (300°C). The device shows a high mobility of 30.17 cm2/Vs, low threshold voltage of 0.4 V, and leakage current density of ~10?8 A/cm2.
机译:需要低温过程来在柔性显示应用上制造在塑料基板上的高性能无定形In-Zn-O(A-IGZO)薄膜晶体管(TFT)。此外,在促进小型化的同时允许更高的迁移率,更高的漏极电流和较低阈值电压的高k材料预先取代传统的SiO 2 TFT中的闸门绝缘体。因此,含有High-K Batio的混合材料 3 纳米颗粒和透明聚硅氧烷(Poly-SX)用作A-IgZo TFT的栅极绝缘体。选择混合材料而不是一个BATIO 3 薄膜可以降低过程温度。本文介绍了A-IGZO TFT在不同BATIO的解决方案加工混合栅极绝缘体的性能 3 /聚-SX比在较低温度(300℃)下沉积。该装置显示出30.17厘米的高迁移率 2 / vs,低阈值电压为0.4 v,漏电流密度为约10?8 A / cm. 2

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