首页> 外文会议>ESAFORM conference on material forming >Physical modelling and identification of polymer viscoelastic behaviour above glass transition temperature and application to the numerical simulation of the hot embossing process
【24h】

Physical modelling and identification of polymer viscoelastic behaviour above glass transition temperature and application to the numerical simulation of the hot embossing process

机译:高于玻璃化转变温度的聚合物粘弹性行为的物理建模和鉴定及其在热压花过程数值模拟中的应用

获取原文

摘要

The experimental processing parameters, such as applied pressure and forming temperature have been analysed during polymer hot embossing of micro-cavities. The viscoelastic characteristics of polymer above the glass transition temperature have been investigated with the classical viscoelastic models. Generalized Maxwell Model has been used to describe polymer behaviours in the glass transition temperature range. The parameters include relaxation time, storage modulus and loss modulus of the Generalized Maxwell Model that have been introduced. The identification of polymer characteristics has been carried out through Dynamic Mechanical Analysis (DMA). The storage modulus, the loss modulus and the damping factor of the selected polymer have been obtained with different imposed frequencies. The master curve of complex modulus has been obtained by applying the time temperature superposition principle. The experimental data has been identified with optimized fitting parameters of Generalized Maxwell Model. A proper agreement between the experimental measurement and the identification of viscoelastic model is observed. The resulting constitutive equations have been implemented in finite element software in order to achieve the numerical simulation of the hot embossing process.
机译:在微腔体的聚合物热压花过程中,已分析了实验加工参数,例如施加的压力和成型温度。用经典的粘弹性模型研究了高于玻璃化转变温度的聚合物的粘弹性特征。广义麦克斯韦模型已用于描述玻璃化转变温度范围内的聚合物行为。这些参数包括已引入的广义麦克斯韦模型的弛豫时间,储能模量和损耗模量。聚合物特性的鉴定已通过动态力学分析(DMA)进行。所选聚合物的储能模量,损耗模量和阻尼系数是通过不同的施加频率获得的。应用时温度叠加原理求出了复模量的主曲线。实验数据已通过通用麦克斯韦模型的优化拟合参数进行了鉴定。观察到实验测量和粘弹性模型的识别之间的适当一致性。为了实现热压花过程的数值模拟,已在有限元软件中实现了所得的本构方程。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号