Electroless deposition of copper alloy in the PEG additive

摘要

In this paper, Cu alloy with rough micro-scale morphology was successfully electroless plated with the help of polyethylene glycol (PEG) additive. The morphology was observed by SEM and electrochemical mechanism of micro-nano-structured Cu alloy formation was analyzed using linear sweep voltammetry. Results show that increase in PEG concentration could inhibit the anodic and cathodic reaction and the growth of secondary structure on the cone surface. The different type of crystallization modifier could result in different surface morphology. And the adsorption effect of PEG increases with the molecular weight.