Copper and graphene composite material prepared by electrodeposition and its potential application for 3D integration

摘要

Cu is commonly used as filling material for TSV in 3D integration [1]. However, there is a problem of thermal mismatch between Cu and Si, and also there is still space for improvement in electrical resistivity. In order to improve the physical properties of TSV electroplating copper, we added high conductivity and low expansion coefficient nanoparticles such as graphene to the copper plating solution. Composite electrodeposition is a convenient method of nano-powders composite coating, so we adopt the method of composite electrodeposition for copper and graphene composite materials. Copper and graphene composite electrodeposition has not been researched particularly. In this paper, we discuss a composite electrodeposition method of copper and graphene and evaluate the physical properties of the composite coatings. Firstly does the graphene dispersion, and under the condition we research the feasibility of copper and graphene composite electrodeposition. And graphene composite samples are obtained. Secondly we test the growth rate and electrical characteristics, and get the growth rate curve and the resistivity of composite material, and compare the result with pure copper material. The result shows that copper and graphene composite electrodeposition is feasible, and the electrical properties of composite samples is a little better than pure copper material sample. It has proved that it has a good application prospect in electrical performance.