copper; electrical resistivity; electromigration; flexible electronics; nanoelectronics; nanoparticles; polymers; reliability; sintering; Cu; copper conductive ink characterization; copper film microstructure; copper nanoparticle ink; electrical resistivity; electromigration resistance; flexible polymer substrate; gold-based ink; inert environment; low-temperature sintering processing; material cost; nano-sized copper particle ink-jet printed conductive films; nitrogen environment; oxidation effect reduction; printed interconnects; sheet resistance; silver-based ink; Copper; Films; Ink; Microstructure; Nanoparticles; Resistance; Substrates;
机译:通过空气中的复合Cu墨水低温烧结在柔性聚合物基材上的制造
机译:1-辛醇中1-辛硫醇包覆的铜纳米粉在低温烧结过程中的导电纳米油墨的合成
机译:降低烧结温度的柔性电子产品铜银自催化混合导电油墨的一步制备
机译:柔性聚合物基底上用于低温烧结工艺的铜导电油墨的表征
机译:使用导电油墨对柔性基板上的原型电路的低成本打印机
机译:闪光灯白光的全光子干燥和烧结过程结合深紫外线和近红外辐射用于高导电性铜纳米油墨
机译:在室温下通过照相机闪光灯烧结的聚合物基材上的喷墨印刷高导电银迹线