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Over-acceleration of corrosion mechanisms during reliability testing: A method to relate biased HAST tests and application conditions for Cu wire products

机译:可靠性测试期间腐蚀机制过度加速:一种涉及偏置Hast试验的方法和Cu线产品的应用条件

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Cu bond wires in microelectronics have great potential but also provides several challenges. The acceleration factors or failure mechanisms in reliability tests are somewhat different with respect to gold wire bonding which, using unchanged but not validated test conditions and duration requirements, may lead to non-justified failures. With copper wire technology, the intermetallic compounds (IMC's) that form between the bond ball and the bond pad change in composition and corrosion behavior when compared to the gold wirebonding IMC's. When exposed to high temperatures, high moisture levels and high bias, these three different stress factors can add up to very high acceleration factors. When a product or material system fails in this test the question arises what the acceleration factor actually is and how this test compares to application conditions where temperatures may also rise significantly while high humidity levels may still be present and bias is applied. This could the operational startup phase after a long time of being in off or standby stage. The product will suddenly heat up due to the internal heat generation but moisture might still be present in the package. Combined with a high bias voltage this could lead to conditions as seen in the HAST test. To make a comparison between application and test, data was collected on the moisture properties of several molding compounds as a function of temperature. This data was then used in combination with thermal transient simulations of a product in application to compare actual moisture levels under use conditions to moisture levels in test. The simulation shows that the HAST test condition never occurs in the actual application and that the test condition is unrealistically accelerating due to the very high moisture loading. Less extreme conditions will be proposed and discussed. Finally some actual corrosion data will be shown that proof the validity of the simulation results.
机译:微电子中的Cu键焊丝具有很大的潜力,但也提供了几个挑战。可靠性测试中的加速因子或故障机制对于金线键合有点不同,该金线键合,使用不变但未经过验证的测试条件和持续时间要求可能导致非实际的故障。通过铜线技术,与金线粘结IMC相比,金属间化合物(IMC)在键合球和粘接焊盘之间形成的组成和腐蚀行为的变化。当暴露在高温下,高水分水平和高偏差时,这三种不同的应力因子可以增加非常高的加速因子。当该测试中的产品或材料系统发生故障时,该问题产生了加速度因素的实际情况以及该测试如何与施加条件进行比较,其中温度也可能显着上升,同时仍然存在高湿度水平并且施加偏差。这可能是在关闭或待机阶段的很长时间后的操作启动阶段。由于内部发热,产品将突然加热,但包装中仍然存在水分。结合高偏压电压,这可能导致在Hast测试中看到的条件。为了在施用和测试之间进行比较,根据温度的函数收集在几种模塑化合物的水分性质上收集数据。然后将该数据与产品中的产品的热瞬态模拟结合使用,以将使用条件的实际水分水平与试验中的水分进行比较。仿真表明,由于实际应用,在实际应用中,在实际应用中不会发生,并且由于较高的水分负荷,测试条件是不切实际的加速。将提出并讨论的极低条件。最后,将显示一些实际的腐蚀数据证明仿真结果的有效性。

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