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Electrical functionalization of thermoplastic materials by cold active atmospheric plasma technology

机译:通过冷活性大气等离子体技术对热塑性材料进行电功能化

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Plasmadust® is a new technology using cold active plasma for additive metallization of different substrate materials. For electronics production, in particular Molded Interconnect Devices (MID), thermoplastic materials can be structured with copper as power electronic conductive pattern. The main advantages of Plasmadust® are the controllable process temperature range between about 90°C and 180°C, the good adhesion of the metallization, the fast process speed of about 100 mm/s and the fast growing conductor tracks with about 15 microns thickness per cycle. Plate specimens were made of PA, a thermoplastic commonly used in automotive applications, with different process parameters. Conductor tracks applied onto the substrates consist of one line with different electrical and mechanical properties according to the process temperature and process speed. Additionally, the thickness and the width of the conductor track depend on the process parameters. The setting of the process speed turns out to be an important influence on the thickness and roughness of the conductor track that can be achieved on thermoplastic substrates. The investigated combination of thermoplastic and copper shows a constant bonding performance during thermal shock testing for 1000 cycles in the range of −40°C and +125 °C. An exposure to humidity heat (85 % r.h / 85°C) for 500 h has only marginal effects on the adhesion of the printed structures on the thermoplastic substrates, too. This highly promising results provide the base for further investigations to achieve a sufficient ampacity related to standard chemical PCB metallization processes.
机译:Plasmadust®是一种使用冷活性等离子体对不同基板材料进行附加金属化的新技术。对于电子产品,特别是模制互连设备(MID),热塑性材料可以用铜作为功率电子导电图案来结构化。 Plasmadust®的主要优点是可控制的工艺温度范围在大约90°C至180°C之间,金属化的良好附着力,大约100 mm / s的快速处理速度以及厚度大约为15微米的快速增长的导体走线每个周期。板状样品由PA制成,PA是汽车应用中常用的热塑性塑料,具有不同的工艺参数。根据处理温度和处理速度,施加到基板上的导体走线由一条具有不同电气和机械特性的线组成。另外,导体线路的厚度和宽度取决于工艺参数。事实证明,处理速度的设置是对可以在热塑性基材上实现的导体走线厚度和粗糙度的重要影响。在-40°C至+125°C的温度范围内进行1000次循环的热冲击测试期间,所研究的热塑性塑料和铜的结合表现出恒定的粘合性能。暴露于湿热(85%r.h / 85°C)下500小时也仅对印刷结构在热塑性基材上的附着力有边际影响。这一极有希望的结果为进一步研究以实现与标准化学PCB金属化工艺相关的足够载流量提供了基础。

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