Comparative investigation of double-layer and double-side micro-channel cooling for power electronics packaging

摘要

In present work, micro-channel heat sink (MCHS) is integrated inside direct bond copper (DBC) for power electronics cooling. Based on commercial CFD code ANSYS Fluent, micro-channels are designed in back Cu-layer of DBC substrate with liquid water as coolant. Two advanced cooling structures, including double-layer (DL) and double-side (sandwich) micro-channel, are investigated. The sandwich structure with counter flows shows reduction in thermal resistance by 59%, 52% and 53% when compare with single-layer (SL), DL with unidirectional flows and DL with counter flows respectively. It also promises uniform temperature-distribution.