Advanced implant application for 7nm and beyond

摘要

The prevailing of mobile devices continuously drives the demand of advanced System on Chip (SOC) development. To meet the high density, high performance, high reliability, low power and scalability requirements, implant applications have been extensively explored, developed and adopted to bring 10nm device and 7nm FinFET Devices into high volume manufacture. In this talk, the key implant related device challenges for 7nm and beyond will be reviewed. Then, a summary of implant applications which will potentially improve SOC device performance and yield will be presented and proposed. With the novel implant approach, device leakage, reliability, contact resistance, and overall uniformity will be improved.