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Investigation of stress states in silicon dies induced by the Low Temperature Joining Technology

机译:低温加入技术诱导硅模具应力状态研究

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The aim of this study was to analyse the stress state in silicon dies joined by Low Temperature Joining Technology (LTJT) based on measurements and simulation results. The focus was to establish a method to determine the initial stress state and stress-free temperature in a silicon die attached to a copper substrate after the joining process. An approach to analyse the evolution of the stress state after sintering and during thermal cycling was developed.
机译:本研究的目的是根据测量和仿真结果分析由低温连接技术(LTJT)连接的硅管芯中的应力状态。 重点是建立一种方法来确定在连接过程之后连接到铜基板上的硅模具中的初始应力状态和压力温度。 开发了一种分析烧结后应力状态和热循环期间的应力状态的进化。

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