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Anomaly Detection and Fault-Mode Isolation for Prognostics Health Monitoring of Electronics Subjected to Drop and Shock

机译:异常检测和故障模式隔离,用于电子设备的预后性健康监测

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In this paper, a new technique has been developed for health monitoring and failure mode classification based on measured damage pre-cursors. A feature extraction technique in the joint-time frequency domain has been developed along with pattern classifiers for fault diagnosis of electronics at product-level. The Karhunen Loeve transform (KLT) has been used for feature reduction and de-correlation of the feature vectors for fault mode classification in electronic assemblies. Euclidean, and Mahalanobis, and Bayesian distance classifiers based on joint-time frequency analysis, have been used for classification of the resulting feature space. Presently, failures in electronics subjected to shock and vibration are typically diagnosed using the built-in self test (BIST) or using continuity monitoring of daisy-chained packages. The BIST which is extensively used for diagnostics or identification of failure, is focused on reactive failure detection and provides limited insight into reliability and residual life. Previously, the authors have developed damage pre-cursors based on time and spectral techniques for health monitoring of electronics without reliance on continuity data from daisy-chained packages. Identification of specific failure modes reported in this paper is new. Various fault modes such as solder inter-connect failure, inter-connect missing, chip delamination chip cracking in packaging architectures have been classified by de-correlating the feature space and identifying dominant directions to describe the space, eliminating directions that encode little useful information about the features. Several chip-scale packages have been studied, with leadfree second-level interconnects including SAC105, SAC305 alloys. Transient strain has been measured during the drop-event using digital image correlation and high-speed cameras operating at 50,000 fps. Continuity has been monitored simultaneously for failure identification. In addition, explicit finite element models have been developed and various kinds of failure modes. The clustered damage pre-cursors have been correlated with underlying damage.
机译:本文基于测量损坏预批准,已经为健康监测和故障模式分类开发了一种新技术。连续频域中的特征提取技术已经开发出具有用于产品级电子设备的故障诊断的图案分类器。 KarhUnen Loeve变换(KLT)已被用于电子组件中故障模式分类的特征向量的特征减小和去相关性。欧几里德和马哈拉诺比斯和贝叶斯距离分类器基于联合时间频率分析,已用于所得特征空间的分类。目前,经过冲击和振动的电子器件的故障通常使用内置自检(BIST)或使用菊花封装的连续性监测来诊断。广泛用于诊断或识别失败的BIST专注于无功故障检测,并提供有限的洞察可靠性和剩余寿命。此前,该作者基于用于电子设备的健康监测的时间和光谱技术,在不依赖来自菊花封装的套件的连续性数据的时间和光谱技术产生损坏。本文报告的特定失效模式的鉴定是新的。各种故障模式如焊料相互连接失败,锁定缺失,封装架构中的芯片分层芯片开裂已经通过去关联特征空间并识别主导方向来描述空间,从而消除编码有关的有用信息的方向特点。已经研究了几种芯片级套件,具有引入二级互连,包括SAC105,SAC305合金。在使用数字图像相关和以50,000 fps运行的高速相机在丢弃事件期间测量瞬态应变。已同时监测连续性以进行故障识别。此外,已开发出明确的有限元模型和各种故障模式。聚类损坏前光标与潜在的损坏相关。

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