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Towards high-k integration with III-V channels: Interface optimization of high pressure sputtered gadolinium oxide on indium phospide

机译:与III-V通道的高k集成:高压溅射族氧化物在铟桥上的界面优化

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We studied the electrical properties of metal-oxide-semiconductor devices based on Gd2O3 deposited on InP by high pressure sputtering and a novel plasma oxidation process. The resulting devices show fully functional capacitance curves., indicating an unpinned Fermi level. The samples were annealed in forming gas at temperatures up to 550°C. We studied the interface trap density of the devices. We found out that with increasing annealing temperature the defect content decreases but at 550°C the capacitance drops and the leakage current increases., indicating a dielectric degradation.
机译:通过高压溅射沉积在INP上的GD 2 基于GD 2 沉积的金属氧化物半导体器件的电气性能和新型等离子体氧化过程。所产生的设备显示出完全功能的电容曲线。,表示未划算的费米水平。在高达550℃的温度下在形成气体中退火样品。我们研究了设备的界面陷阱密度。我们发现,随着退火温度的增加,缺陷含量降低但在550°C时,电容下降和漏电流增加。,表示介电降解。

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