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Non-woven Membranes of ODPA-ODA Polyimide Prepared by Electrospinning

机译:通过静电纺丝制备的ODPA-ODA聚酰亚胺的无纺布膜

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In the present study, a new process for making non-woven membranes of polyimide (PI) using as insulation materials was described. The ODPA-ODA PI fibers are prepared by electrospinning a poly (amic acid) (PAA) solution, a precursor of polyimide, synthesized from 4,4'-oxydianiline (ODA) and 4,4'-oxydiphthalic anhydride (ODPA), followed by thermal imidization. The chemical structure, surface morphology, thermal stability of ODPA-ODA PI and PAA were characterized by Fourier Transform Infrared Spectroscope (FT-IR), Scanning Electron Microscope (SEM) and Thermogravimetry Analysis (TGA) respectively. The fibers of PAA with average diameters less than 1μm appeared to be densely packed on the surface. The fibers of ODPA-ODA PI with the diameters less than 500nm obtained after imidization at 300°C exhibited shrinkable, twisted and ribbon-shaped cross section. The ODPA-ODA PI non-woven membranes with decomposition temperature of above 500°Cpossess excellent heat-resistance.
机译:在本研究中,描述了使用作为绝缘材料制备聚酰亚胺(PI)的非织造膜的新方法。通过静电纺丝制备ODPA-ODA PI纤维,通过静电(氨基酸)(PAA)溶液,聚酰亚胺的前体,由4,4'- oxydianiline(ODA)和4,4'- oxydhehthalic酸酐(ODPA)合成,接下来通过热酰亚胺化。通过傅里叶变换红外分光镜(FT-IR),扫描电子显微镜(SEM)和热重分析(TGA),表征了化学结构,表面形态,ODPA-ODA PI和PAA的热稳定性。平均直径小于1μm的PAA的纤维似乎密集地填充在表面上。 ODPA-ODA PI的纤维在300°C的酰亚胺化后获得的直径小于500nm,表现出可收缩,扭曲和色带形横截面。 ODPA-ODA PI非织造膜,分解温度高于500°CPOSSESS优异的耐热性。

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