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Cross Conduction Analysis for Enhancement-Mode 650-V GaN HFETs in a Phase-Leg Topology

机译:用于相位腿部拓扑中增强模式650V GaN HFET的交叉传导分析

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Cross conduction is a well-known issue in buck converters and phase-leg topologies, in which fast switching transients cause spurious gate voltages in the synchronous device and a subsequent increase in switching loss. Cross conduction can typically be mitigated with a well-designed gate drive, but this is challenging with WBG devices. Phase legs using SiC and GaN devices can experience heavy cross conduction loss due to their exceptionally fast switching transients. Enhancement-mode GaN heterojunction field-effect transistors (HFETs) in the 600-V class are now commercially available, with switching transients as fast as 200 kV/μs. A double pulse test setup was used to measure the switching loss of one such GaN HFET, with several gate drive circuits and resistances. The results were analyzed and compared to characterize the effects of cross conduction in the active and synchronous devices of a phase-leg topology with enhancement-mode GaN HFETs.
机译:交叉传导是降压转换器和相位腿拓扑中的众所周知的问题,其中快速切换瞬变使同步装置中的杂散栅极电压和随后的开关损耗增加。通常可以通过精心设计的栅极驱动器来减轻交叉传导,但这与WBG装置有挑战性。通过SIC和GaN设备的相位腿可能由于其出色的开关瞬态而感到厚重的交叉传导损耗。 600V类中的增强型GaN异质结现场效应晶体管(HFET)现在是商业上的,具有快速为200kV /μs的切换瞬态。双脉冲测试设置用于测量一个这样的GaN HFET的开关损耗,具有几个栅极驱动电路和电阻。分析结果并比较了与增强模式GaN HFET的相位腿拓扑的有源和同步装置中交叉传导的影响。

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