Moore's Law has served as the guiding principle for the semiconductor industry for 50 years. The societal impact brought about by continually increasing the capability, affordability, and availability of integrated circuits is astonishing. Increasing computing power, increasing energy efficiency, and decreasing size of ICs have revolutionized existing industries and enabled new ones. While concerns over the future of Moore's Law have been present from the beginning, the challenges have changed over time. Currently, the challenges of scaling and increasing cost are the focus of concerns and doubts over the vitality of Moore's Law going forward. However, the industry continues to drive progress on many fronts. Continued advances in CMOS technology such as the introduction of 3D transistors provide increasing capabilities over a broader range of use. Novel 3D-heterogeneous-integration schemes and novel package technologies will further extend product benefits. At the same time, new memory technologies provide opportunities to fundamentally change memory hierarchy and bandwidth to resolve challenges in processor performance and power. In addition to the scaling of CMOS technology beyond 14nm, there are leading technology options on the horizon beyond CMOS with potential design benefits that can advance Moore's Law well into the future.
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