Failure Analysis of Nickel Silicide Piping Failures: A Case Study

摘要

As semiconductor geometries decrease, the size of a defect that leads to circuit failure also decreases. Some defects can be almost invisible or overlooked, especially when they occur in areas that are not directly observable with analysis tools available. While many defects will cause photoemission or observable leakage paths, occasionally a defect will occur in an area that cannot be easily analyzed. Using all available techniques will allow the defect characteristics to be defined.