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Localization of Dead Open in a Solder Bump by Space Domain Reflectometry

机译:通过空间域反射法对焊锡凸点中的死区进行定位

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Space Domain Reflectometry (SDR) is a newly developed non-destructive failure analysis (FA) technique for localizing open defects in both packages and dies through mapping in space domain the magnetic field produced by a radio frequency (RF) current induced in the sample, herein the name Space Domain Reflectometry. The technique employs a scanning superconducting quantum interference device (SQUID) RF microscope operating over a frequency range from 60 to 200 MHz. In this paper we demonstrate that SDR is capable of locating defective micro bumps in a flip-chip device.
机译:Space Domain Reflectometry(SDR)是一项新开发的非破坏性失效分析(FA)技术,可通过在空间域中映射样品中感应的射频(RF)电流产生的磁场来定位封装和管芯中的开放缺陷,这里的名称是“空间域反射法”。该技术采用在60至200 MHz频率范围内运行的扫描超导量子干涉仪(SQUID)RF显微镜。在本文中,我们证明了SDR能够定位倒装芯片器件中的缺陷微凸点。

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