Radiation Mechanisms and Electromagnetic Interference in Ceramic Electronic Packages

摘要

A full-wave electromagnetic analysisfor characterizing typical electromagneticshielding practices in ceramic electronicpackages is presented. Typically in printedcircuit board emissions, the power planeemissions, and exposed surface nets areconsidered, however, the signal interconnectfrom the PCB to an electronic package canalso be a significant source of radiation andhence an electromagnetic interference (EMI)issue. In this paper we describeelectromagnetic radiation mechanismsresulting from high-frequency and high-speedapplications in ceramic multilayer electronicpackages and review the typical practice ofimplementing via fences to mitigate andreduce the EMI risk within a package substrateand also for the case when the package is partof a package/board configuration.