The Common Failure Mechanisms of Plastic Encapsulated Devices Induced by Package Defect

摘要

Plastic encapsulated devices are gaining wide acceptance due to advantages in size, weight, cost, availability, performance, and state of-the-art technology and design. However, the long-term reliability of plastic encapsulated devices is influenced by the inherent structures and materials. The paper introduced three common failure mechanisms of plastic encapsulated devices induced by package defect: interfacial delamination, poor die attachment and poor encapsulation material. The failure mechanisms were illuminated by theories combining with cases.