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Preparation, liquid crystal property and thermodynamic property of Amine-terminated polyesterimide, as modifiers for epoxy resin

机译:胺封端聚酯酰亚胺的制备,液晶性能和热力学性能,作为环氧树脂的改性剂

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摘要

Epoxy resin is widely used in electronic packaging. However, neat epoxy resin is no suitable for high-performance applications because of its poor thermal stability and toughness. Polyimide is a kind of materials with high performance for their excellent thermal stability, dimensional stability and electric property, but it is generally insoluble and infusible, and this makes it difficult to process. In this study, Amine-terminated polyesterimide (ATPEI) polymers was synthesized and used as modifier of epoxy resin. The chemical structure of ATPEI was characterized by FT-IR spectrum. The two melting peaks of differential scanning calorimetry (DSC) show ATPEI manifested liquid crystal properties, which could be verified by Polarizing microscope (POM) and X-ray diffraction (XRD) respectively. ATPEI was used to improve the thermostability, mechanical properties and especially the toughness of bisphenol A diglycidyl ether epoxy resin(ER) cured with 4,4'-Methylenedianiline (DDM). The results show that the decomposition temperature of modified materials improve about 30°C compared with that of unmodified epoxy resin. The mechanical and dynamic mechanical properties were measured by universal testing machine and DMA. The results exhibit that ATPEI modified epoxy resin has good toughness.
机译:环氧树脂广泛用于电子包装。然而,由于其热稳定性和韧性差,纯环氧树脂不适合高性能应用。聚酰亚胺是一种具有高性能的材料,具有优异的热稳定性,尺寸稳定性和电性能,但它通常不溶于和脱模,这使得难以处理。在该研究中,合成胺封端的聚酯酰亚胺(ATPEI)聚合物并用作环氧树脂的改性剂。 ATPEI的化学结构的特征在于FT-IR光谱。差示扫描量热法(DSC)的两个熔化峰显示ATPEI表现出液晶特性,可以通过偏振显微镜(POM)和X射线衍射(XRD)来验证。 ATPEI用于改善热稳定性,机械性能,尤其是双酚A二缩水甘油醚环氧树脂(ER)用4,4'-甲基二胺(DDM)固化的韧性。结果表明,与未修饰的环氧树脂相比,改性材料的分解温度可改善约30℃。通过通用测试机和DMA测量机械和动态机械性能。结果表明,Atpei改性环氧树脂具有良好的韧性。

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