Comparative Study of Electromechanical Behavior of Lead-Free Sn-Al Solder and Traditional Lead Solder for High Temperature Applications

摘要

The performance of a Tin-Aluminum alloy is experimentally investigated in terms of its major mechanical and electrical conduction characteristics under both DC and AC fields to verify it as a suitable candidate for lead-free soldering material in high temperature applications. More specifically, different measuring samples are prepared from direct casting of 80% Tin and 20% Aluminum for the material characterization of the alloy in terms of microhardness, DC conductivity, frequency-dependent impedance as well as dielectric function. The suitability and practicability of the solder material is judged through a comparative analysis of the measured properties with those of traditional Tin-Lead solder material of identical composition (80%Tin-20%Lead). Optical microscopic images of the parent as well as solder materials are also considered in the process of comparison to make the verification more effective.