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Study of the impact of growth and post-growth processes on the surface morphology of 4H silicon carbide films

机译:研究生长和后生长过程对4H碳化硅膜表面形态的影响

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In this paper we study the surface morphology of <11-20> 4° degree off, silicon terminated, 4H Silicon Carbide (4H-SiC) in terms of growth parameters and post growth argon thermal annealing. We find that out-of-equilibrium conditions favor the reduction of the surface roughness. Furthermore, we find preliminary indications that the same growth parameters that lead to the reduction of the surface roughness promote also a reduction of (1,3) and (4,4) stacking faults density.
机译:在本文中,我们根据生长参数和生长后氩热退火技术研究了<11-20>偏离4°度,硅封端的4H碳化硅(4H-SiC)的表面形态。我们发现不平衡条件有利于减小表面粗糙度。此外,我们发现初步迹象表明,导致表面粗糙度降低的相同生长参数也促进了(1,3)和(4,4)堆垛层错密度的降低。

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