In the CMP process, the stability of slurry flow influences the amount and distribution of the removal rate. The present paper describes the effect of a new slurry-flowback mechanism on slurry flow and the removal rate under a high rotational velocity of a tool. Experimental results revealed that the newly developed slurry-flowback tool can cause the slurry to circulate to the polishing area through the interior of the tool. As a result of the stable slurry flow generated by the new flow mechanism, the removal rate increased under the high rotational velocity of the tool of 500 min~(-1) such that polishing pads with ordinary lattice groove patterns are unable to polish a wafer.
展开▼
