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Power reduction of CMP communication networks via RF-interconnects

机译:通过RF互连的CMP通信网络的功率降低

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As chip multiprocessors scale to a greater number of processing cores, on-chip interconnection networks will experience dramatic increases in both bandwidth demand and power dissipation. Fortunately, promising gains can be realized via integration of Radio Frequency Interconnect (RF-I) through on-chip transmission lines with traditional interconnects implemented with RC wires. While prior work has considered the latency advantage of RF-I, we demonstrate three further advantages of RF-I: (1) RF-I bandwidth can be flexibly allocated to provide an adaptive NoC, (2) RF-I can enable a dramatic power and area reduction by simplification of NoC topology, and (3) RF-I provides natural and efficient support for multicast. In this paper, we propose a novel interconnect design, exploiting dynamic RF-I bandwidth allocation to realize a reconfigurable network-on-chip architecture. We find that our adaptive RF-I architecture on top of a mesh with 4B links can even outperform the baseline with 16B mesh links by about 1%, and reduces NoC power by approximately 65% including the overhead incurred for supporting RF-I.
机译:随着芯片多处理器刻度为更大数量的处理核心,片上互连网络将经历带宽需求和功耗的戏剧性增加。幸运的是,可以通过通过片上传输线集成射频互连(RF-I)与具有RC线实现的传统互连的芯片传输线来实现有前途的收益。虽然事先工作已经考虑了RF-I的潜伏处优势,但我们证明了RF-I的另外三个优点:(1)可以灵活地分配RF-I带宽以提供自适应NOC,(2)RF-I可以实现戏剧性的通过简化NOC拓扑的功率和面积减少,(3)RF-I为多播提供自然和有效的支持。在本文中,我们提出了一种新颖的互连设计,利用动态RF-I带宽分配来实现可重新配置的片上芯片架构。我们发现,具有4B链路顶部的电子Adaptive RF-I架构甚至可以优于16B网格链路的基线,大约1%,并将NoC功率降低约65%,包括用于支持RF-I的开销。

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