Thin film multilayers have previously been introduced on multilayer low temperature cofired ceramic (LTCC). Theruggedness of a multipurpose Ti-Cu-Pt-Au stack has continued to benefit fabrication and reliability in state-of-theartmodules. Space optimization is described, preserving miniaturization of critical spaces and component pads.Additional soldering details are also presented, including trends with solder-stop materials. Feature compensationbecomes a simple step in the normal manufacturing flow which enables exact targeting of desired feature sizes. Inaddition, fine details of the manufacturing process, including ion milling, will be discussed. We will discuss fulllong-term aging results and structural details that reinforce the reliability and function. Different thin filmmaterials for specific applications can be exploited for additional capabilities such as filters and other integralcomponents. Cross sections verify the results shown. This successful integration of thin films on LTCC points tohigher frequencies which require finer lines and spaces. Advancements of these applications become possible dueto the associated progression of smaller skin depth and thinner metallic material.
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