Design and Process Implementation for Embedding Components

摘要

Although the printed circuit has traditionally served as the platform for mounting and interconnecting active andpassive components on the outer surfaces, companies attempting to improve product functionality and minimizespace are now considering embedding a broad range of these components within the circuit structure. Both uncasedactive and passive component elements are candidates for embedding but the decision to embed components withinthe multilayer circuit structure must be made early in the design process. Some components are easy candidates forintegrating into the substrate while other may involve more complex processes and will be difficult to rationalize.Although many of the discrete passive and active devices may remain mounted on the outer surfaces of the multilayerboard, embedding passive components and one or more silicon based semiconductor elements within the innerlayers of the subsrate will enable greater utilization of the circuit board structure. Benefits can include improvedperformance. For example, by embedding the uncased semiconductor element on an inner layer of the circuitvertically in-line with a related semiconductor package mounted on the outer surface, the conductor interface canbe minimized. The close coupling of semiconductor elements will significantly reduces resistance, inductance andcontributes to increasing signal speed.This paper includes design guidelines, material selection and the use of micro-via build-up termination methodologyfor embedding and interconnecting miniature passive components; resistor, capacitor, inductor, discrete transistorelements and thinned semiconductor elements. Detailed process information and examples will be included toenable the product designer and manufacturing specialist to have a clear understanding of the principles forembedding and interconnecting components in an organic multilayer circuit board structure.