Applications of 3D X-Ray Microscopy for Advanced Package Development

摘要

This paper describes the utilization of non-destructive imaging using 3D x-ray microscopy for package developmentand failure analysis. Four case studies are discussed to explain our methodology and its impact on our advancedpackaging development effort. Identifying and locating failures embedded deep inside the package, such as a solderfatigue failure within a flip chip package, without the need for physical cross-sectioning is of substantial benefitbecause it preserves the package for further analysis. Also of utility is the ability to reveal the structural details ofthe package while producing superior quality 2D and volumetric images. The technique could be used not only foranalysis of defects and failures, but also to characterize geometries and morphologies during the process andpackage development stage.