HIGH-LIFETIME WAFER CLEANING METHOD USING OZONE DISSOLVED IN DIW/HF/HCL SOLUTION

摘要

In this work, ozone dissolved in deionized water (DIO_3) cleaning is investigated as a low-cost alternative method to the current wet-chemical cleaning in high-efficiency solar cell manufacturing. Higher effective lifetime and lower J_0 were achieved, compared to the reference cleaning process of high-lifetime RCA, by simply adding a small amount of HF and HCl to DIO_3 solution. The effective lifetime of cleaned and passivated wafers increased as the processing time in DIO_3/HF/HCl cleaning solution increased. The stability of the wafer lifetime even after some storage time of up to an hour post cleaning makes the DIO_3/HF/HCl cleaning suitable for industrial application. The DIO_3/HF/HCl cleaning shows a great potential to be a high-lifetime wet-chemical cleaning process in mass production.