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Surface termination and roughness of Ge(100) cleaned by HF and HCl solutions

机译:用HF和HCl溶液清洗的Ge(100)的表面终止和粗糙度

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Oxide removal from Ge(100) surfaces treated by HCl and HF solutions with different concentrations are systematically studied by synchrotron radiation photoelectron spectroscopy (SR-PES). SR-PES results show that clean surfaces without any oxide can be obtained after wet chemical cleaning followed by vacuum annealing with a residual carbon contamination of less than 0.02 monolayer. HF etching leads to a hydrogen-terminated Ge surface whose hydrogen coverage is a function of the HF concentration. In contrast, HCl etching yields a chlorine-terminated surface. Possible etching mechanisms are discussed. Surface roughness after HF and HCl treatments is also investigated by atomic force microscopy which shows that HF treatment leaves a rougher surface than HCl.
机译:通过同步加速器辐射光电子能谱(SR-PES)系统研究了用不同浓度的HCl和HF溶液处理过的Ge(100)表面的氧化物去除。 SR-PES结果表明,在进行湿法化学清洁,然后进行真空退火并进行残留碳污染小于0.02单层的真空退火后,可以获得没有任何氧化物的清洁表面。 HF蚀刻导致氢封端的Ge表面,其氢覆盖率是HF浓度的函数。相反,用HCl蚀刻可得到氯端表面。讨论了可能的蚀刻机制。还通过原子力显微镜研究了HF和HCl处理后的表面粗糙度,结果表明HF处理后的表面比HCl粗糙。

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