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PROGRESS IN MECHANICALLY SHUTTERED TIME-RESOLVED PHOTOLUMINESCENCE IMAGING OF SILICON WAFERS

机译:机械化硅片时间分辨光致发光成像技术的进展

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Recently two approaches to extend the photoluminescence imaging (PLI) technique by evaluating thedynamic properties of the sample have been presented. Time-resolved photoluminescence measurements may providecalibration-free maps of the effective minority charge carrier lifetime in silicon wafers. Due to the transient measurementthey minimize errors due to lateral inhomogeneities in setup or sample, which would usually contribute linearly tosteady-state PLI measurements. In this work, we will focus on mechanically shuttered time-resolved photoluminescenceimaging (TR-PLI), as it provides a high measurement range down to 5 μs at low hardware costs.
机译:最近,有两种方法通过评估光致发光成像技术来扩展光致发光成像(PLI)技术。 已经介绍了样品的动态特性。时间分辨的光致发光测量可以提供 硅晶片中有效少数载流子寿命的免校准图。由于瞬态测量 它们可最大程度地减少由于设置或样品中的横向不均匀性而引起的误差,这些误差通常会线性地影响 稳态PLI测量。在这项工作中,我们将专注于机械快门时间分辨的光致发光 成像(TR-PLI),因为它以较低的硬件成本提供了低至5μs的高测量范围。

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