首页> 外文会议>The 16th International Conference on olid-State Sensors, Actuators and Microsystems >Transfer technology of pyrolyzed polymer onto low thermal tolerance substrate
【24h】

Transfer technology of pyrolyzed polymer onto low thermal tolerance substrate

机译:热解聚合物在低耐热性基材上的转移技术

获取原文

摘要

This paper reports a novel process for transfer of a pyrolyzed polymer even onto a low thermal tolerance substrate such as polymer films. Conventionally, it was difficult to form pyrolyzed polymer on low thermal tolerance substrate because of high annealing temperatures for transforming dielectric poymer to conductive materials. We successfully demonstrated formation of a pyrolyzed polymer on a polymer film. In terms of applications, the formation of metal patterns such as Au electrodes with the transferred pyrolyzed polymer becomes essential. Thus, we propose a process for transfer of the Au/pyrolyzed polymer combined layer. Materials and thickness of barrier layers, process parameters of post-annealing and surface activation are investigated to ensure the proposed transfer process.
机译:本文报道了一种将热解聚合物甚至转移到低耐热性基材(例如聚合物薄膜)上的新型方法。常规地,由于将电介质聚合物转变成导电材料的退火温度高,因此难以在低耐热性基板上形成热解聚合物。我们成功地证明了热解聚合物在聚合物膜上的形成。就应用而言,利用转移的热解聚合物形成金属图案(例如Au电极)变得至关重要。因此,我们提出了转移Au /热解聚合物结合层的方法。研究了阻挡层的材料和厚度,退火后的工艺参数以及表面活化,以确保所提出的转移过程。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号