Enhanced thermal conductivity of novel multifunctional polyphenylene sulfide composites embedded with heat transfer networks of hybrid fillers

摘要

Today's smaller, more powerful electronic devices, communications equipment, and lighting apparatus required optimum heat dissipation solutions. Traditionally, metals are widely known for their superior thermal conductivity; however, their good electrical conductivity has limited their applications in heat management components for microelectronic applications. This prompts the requirement to develop novel plastic composites that satisfy multifunctional requirements thermally, electrically, and mechanically. Furthermore, the moldability of polymer composites would make them ideal for manufacturing three-dimensional, net-shape enclosures and/or heat management assembly. Using polyphenylene sulfide (PPS) as the matrix, heat transfer networks were developed and structured by embedding hexagonal boron nitride (BN) alone, blending BN fillers of different shapes and sizes, as well as hybridizing BN fillers with carbonaceous nano- and micro-fillers. Parametric studies were conducted to elucidate the effects of types, shapes, sizes, and hybridization of fillers on the composite's thermal and electrical properties. The use of hybrid fillers, with optimized material formulations, was found to effectively promote a composite's thermal conductivity. This was achieved by optimizing the development of an interconnected thermal conductive network through structuring hybrid fillers with appropriate shapes and sizes. The thermal conductive composite affords unique opportunities to injection mold three-dimensional, net-shape microelectronic enclosures with superior heat dissipation performance.