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Low voltage superjunction power MOSFET: An application optimized technology

机译:低压超结功率MOSFET:一种应用优化技术

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A detailed analysis of the power loss mechanisms in synchronous DC-DC converters has been undertaken to identify the critical MOSFET parameters that require improving to ensure that system efficiencies and power densities continue to increase. The analysis shows that the commonly used figures of merit (FOMs) based on QG and QGD (i.e. RDS(on)×QG and RDS(on)×QGD) are no longer sufficient when developing power MOSFET technologies, and if followed religiously, can lead to non-optimal technology choices. The insights gained from this work have been employed to define a set of FOMs that were then used to develop a new low voltage power MOSFET technology. The resulting 30V technology, based on the superjunction concept, is ideally suited for DC-DC conversion and in contrast to competing technologies such as lateral and split-gate trench MOSFETs, this approach simultaneously offers low specific RDS(on), QG, QGD, QOSS, and high gate-bounce immunity.
机译:已经对同步DC-DC转换器中的功率损耗机制进行了详细分析,以识别需要改进的关键MOSFET参数,以确保系统效率和功率密度不断提高。分析表明,基于Q G 和Q GD (即R DS(on)×Q)的常用品质因数(FOM)在开发功率MOSFET技术时, G 和R DS(on)×Q GD )不再足够,并且如果认真地遵循,可能会导致非最佳技术选择。从这项工作中获得的见解已被用于定义一组FOM,然后将其用于开发新的低压功率MOSFET技术。由此产生的30V技术基于超结概念,非常适合DC-DC转换,与横向和分离栅沟槽MOSFET等竞争技术相反,该方法同时提供了低比R DS(on) / inf>,Q G ,Q GD ,Q OSS 和高门反弹抗扰性。

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