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A SPICE Macromodel for the Analysis of Lossy Dispersive Coupled GaAs Interconnect Line System

机译:用于分析有损色散耦合砷化镓互连线系统的SPICE宏模型

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A SPICE macro model for the transient analysis of lossy dispersive coupled GaAs interconnect line system is considered. The model is based on finite Fourier integral transform in spatial domain and is used to the study the transient nature of the signals, signal delays, distortions and cross talk in IC interconnections in digital integrated circuits. An equivalent circuit model is derived from the resulting nonlinear differential equations and is implemented as a macro model in a general purpose circuit simulator, SPICE. The model provides an easy method of including skin effect and dispersion of the lines. This macro model is an alternative method to the multiple PI or Tee sections lumped element modeling of distributed systems. The simulation times and accuracy are well compared to the reduced order PI section lumped element models.
机译:考虑了用于有损色散耦合GaAs互连线系统瞬态分析的SPICE宏模型。该模型基于空间域中的有限傅立叶积分变换,用于研究数字集成电路中IC互连中信号的瞬态特性,信号延迟,失真和串扰。从所得的非线性微分方程式导出等效电路模型,并在通用电路仿真器SPICE中将其实现为宏模型。该模型提供了一种包括集肤效果和线条散布的简便方法。该宏模型是分布式系统的多个PI或Tee部分集总元素建模的替代方法。与降阶PI截面集总元素模型相比,仿真时间和精度很好。

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