Co-firing behavior and interfacial structure of dielectric/ferrite composites for multi-layer LC filters

摘要

Multi-layer thick film LC filters are very important miniaturized devices in mobile telecommunication. These devices are usually fabricated by co-firing of ferrite-based inductors and dielectric-based capacitors. However, the warpage problem and interfacial reaction of LC chip devices during sintering are inevitable due to the mismatching shrinkage and element diffusion between L and C layers. This paper presented the co-firing behavior and interfacial structure of dielectric/ferrite multi-layer composites.